Carsem announces manufacturing capability into LED solutions
Date Announced: 09 May 2012
Ipoh, Malaysia -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they are now entering a partnership with a key customer to assemble and further develop LED packaging technologies.
Carsem has successfully assembled and qualified High Brightness Silicon Substrate LED Arrays and will begin offering high-volume, full turn-key manufacturing services, including electrical testing, laser mark and tape-and-reel, in early 2012.
The manufacturing process fully utilizes the advantage of standard mass production process of assembly and test including matrix substrate design; auto die attach, wire bond and high reflection coating dispense; compression molding through automold system; mapping of units on substrate and bin sort per test mapping.
This Silicon Substrate LED Array offers higher white light brightness with much less energy required (>50 lumens/watt). The life expectancy of the product is estimated at 10 years. General applications can be home use, cars, special light effect, etc.
Albert Law, Carsem’s V.P. of World Wide Sales and Marketing stated, “Because of our extensive experience in providing turnkey solutions, we are able to share our expertise with our LED customers and assist them in getting their products to market faster with turnkey solution on high density and high volume packaging, Carsem is expanding the company’s portfolio to include LED packaging solutions for the High Brightness LED applications.”
Carsem’s Chief Technology Officer, L.W. Yong stated, “By capitalizing on our extensive semiconductor experience in materials, process & equipment we have successfully advanced into the LED arena and thereby enhancing the manufacturability and efficiency of High Brightness LED”
Anyone interested in further details about this new package should contact your local Carsem sales office, which can be found on the Carsem web site at www.carsem.com.
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes many advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip On Leadframe (FCOL), an SiP (System-in-Package) Technology, Cavity-Package Motion and Pressure Sensor technologies as well as stacked-die capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK, China, Malaysia and Taiwan.
Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.
Press Contact: Albert Law
VP of World Wide Sales and Marketing
Telephone Number: +60 5 3123333
Fax Number: +60 5 3125333
Web Site: www.carsem.com