DuPont Circuit & Packaging Materials scales up thermal substrate production in Taiwan
Date Announced: 03 Jun 2013
Taiwan-based Expansion to Boost Supply of Advanced Thermal Substrates for LED Lighting
RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials, part of DuPont Electronics & Communications, announced today that it has increased its ability to produce and supply DuPont™ CooLam® thermal substrate products by more than seven times its previous level, to better serve its customers in the fast-growing global light emitting diode (LED) lighting market. DuPont™ CooLam® thermal substrates are designed to dissipate heat in LED lighting applications which help enable LED manufacturers to offer longer life, greater reliability and better light quality from LED bulbs.
"Demand for LED lighting is expected to surge while the price of LED bulbs continues to fall, as evidenced by the high-quality, energy-efficient $10 USD LED bulbs that are now available from home improvement stores," said Michael J. Green, global business development manager, DuPont Circuit & Packaging Materials. "We expect to see even more LED lighting products made with DuPont™ CooLam® thermal substrates as the market continues to grow, and are extremely pleased to increase our ability to supply more of this innovative material to enable our customers to produce LED lighting with longer life, greater reliability, affordability and better light quality."
The global LED lighting market grew about 80 percent year-over-year between 2011 and 2012, and is projected to grow another 50 percent from 2012 to 2013, according to industry estimates. DuPont, which began producing CooLam® at its manufacturing facility in Towanda, Pa., has scaled up additional production at its state-of–the–art Hsinchu, Taiwan, facility to accommodate this greater demand.
For an LED light bulb to deliver a long and efficient life span, a reliable thermal substrate is required. DuPont™ CooLam® thermal substrates, made with a proprietary polyimide dielectric specially designed to be thermally conductive, dissipates heat more rapidly and more reliably than conventional filled epoxy-based boards. With very low thermal impedance, and a maximum operating temperature of 180° C, CooLam® thermal substrates help ensure stable performance over a wide range of environmental conditions.
DuPont offers three CooLam® product types for today's demanding thermal applications. The newest, CooLam® 3D thermal substrates are designed for innovative omnidirectional A-19 replacement bulbs and general lighting fixtures, where directed lighting is required. CooLam® LX is designed for LED replacement bulbs, and other lighting applications like high bay lighting and outdoor LED lighting, where very low thermal impedance is required. CooLam® LA is designed for general LED lighting with more stringent electrical performance needs. For more information, please visit http://led.dupont.com.
In addition to CooLam® thermal substrates, DuPont Circuit & Packaging materials offers a broad and growing portfolio of products including dry film photoresists and phototooling films for printed circuit board (PCB) imaging, polyimide films, flexible circuit materials and embedded passive materials.
DuPont (NYSE: DD) has been bringing world-class science and engineering to the global marketplace in the form of innovative products, materials, and services since 1802. The company believes that by collaborating with customers, governments, NGOs, and thought leaders we can help find solutions to such global challenges as providing enough healthy food for people everywhere, decreasing dependence on fossil fuels, and protecting life and the environment.
Noelle D. Hagen
DuPont Electronics & Communications
Web Site: led.dupont.com