BridgeLux, a fables LED chip supplier, has responded to the patent lawsuit filed against it by Cree and Boston University last month (see Cree sues BridgeLux for patent infringement). As well as seeking to have the lawsuit dismissed, BridgeLux has responded with its own lawsuit.
BridgeLux has filed a motion to dismiss the Cree/BU lawsuit, which alleges infringement of US patents no. 6,657,236 and 5,686,738. "We reiterate our belief that Cree’s lawsuit is without merit, and we will vigorously defend against the claims that have been brought," said Robert Walker, CEO of BridgeLux.
BridgeLux is also seeking declaratory relief against Cree and BU. If granted, this would state that BridgeLux does not infringe the ‘236 and ‘738 patents, as well as certain other Cree patents.
In addition, BridgeLux has filed suit against Cree for infringement of US patent number 6,869,812 entitled "High power AllnGaN based multi-chip light emitting diode". The patent, filed in May 2003 and granted in March 2005, is assigned to Heng Lui, BridgeLux's founder and chief technology officer.
Download US patent 6,869,812 as a PDF file
The patent describes a chip with a substantially transparent substrate and an elongated geometry, preferably with an aspect ratio of 4:1 and sides of around 1000 micron and 250 micron. The purpose is to provide enhanced efficiency and brightness.
"We believe in the importance of respecting the intellectual property rights of others, just as we expect that others will respect our rights," said Walker.
New side-emitting chips
BridgeLux has released its new BSV Series side-view LED chip product line, which are based on the patented structure for elongated geometry described in US patent no. 6,869,812.
The elongated chips, available in 10x18 mil and 10x23 mil sizes, feature a rectangular shape, enabling thinner displays for mobile phones, PDAs, digital still cameras, MP3 players and notebook PCs.
When combined with commercially available phosphors, BridgeLux says that its BSV series blue chips will deliver 1500 mcd typical luminous intensity for a packaged white LED, allowing it to serve in a wide variety of white-light solutions in backlight applications.
The chips are currently in qualification with selected customers, with volume production quantities available in late 2006.
