Palomar Technologies delivers a Total Process Solution™ for advanced photonic and microelectronic device assembly processes. Palomar offers die bonders, wire and wedge bonders, vacuum reflow systems, along with outsourced manufacturing.
Contract assembly, process development, test and prototyping division of Palomar Technologies for high-precision, high-accuracy die attach and wire bonding services without having...
High-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless and medical applications. Has configuration...
Carlsbad, CA – February 4, 2021 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced...
Carlsbad, CA – December 21, 2020 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced...
Carlsbad, CA – Sept 29, 2020 – Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging today announced the...
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