Load locked system for low temperature deposition of semiconductor films on wafers. Deposition temperatures a low as 85 deg. C with good coating qualities and properties.
Load locked system for etching metals, oxides, and nitrides. Accommodates wafers or sample s up to 8" dia. Typical applications are for deep etching requirements with vertical...
R&D system for coating of materials on wafers and other substrates. Process wafers up to 8" dia. typical coating s ar produced with low stress and excellent uniformity.