Indium Corporation has released a new ball-attach flux, WS-829, designed for printing and pin transfer applications for the smallest sphere and high-density applications, including LED die-attach.
WS-829 is a water-soluble, halogen-free flux that can be used for ball-attach on substrate in a standard ball-grid array (BGA) manufacturing process (especially for the smallest sphere applications < 0.25mm) as well as wafer-/panel-level packaging (WLP/PLP).
WS-829 features:
· Best-in-class flux residue cleanability when using only DI water; it also effectively cleans off contamination or pad oxidation from processes before ball mount
· High tackiness, which holds event the smallest solder spheres and LED die in place, and reduces missing balls or die skew defects
· A formulation that ensures consistent flux definition over long periods of time with minimal slump
Indium Corporation offers a robust portfolio of flux products designed for new or emerging industry challenges. To learn more about Indium Corporation’s fluxes, visit www.indium.com/ball-attach.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
