Master Bond EP21TDCN-LO is a two component, nickel filled, electrically conductive, adhesive for high performance bonding and sealing. Both Part A and Part B have smooth paste consistencies. The mix ratio is a forgiving one to one by either weight or volume. It cures readily at room temperature in 3-4 days, or, alternatively, at 150-200°F for 2-3 hours. The optimum cure is overnight at room temperature, followed by 2-3 hours at 150-200°F. The volume resistivity of the cured system is 5-10 ohm-cm. It is 100% reactive and does not contain any diluents or solvents.
Considering that it is an electrically conductive adhesive, EP21TDCN-LO has a reasonably good physical strength profile. It bonds well to metals, composites, ceramics and many plastics. Both Parts A and B are colored nickel. Most importantly, it is a toughened system, formulated to withstand relatively rigorous thermal cycling as well as mechanical vibration and shock. The service temperature range is -100°F to +275°F. It has good resistance to fuels, oils and water. EP21TDCN-LO is particularly effective for grounding and shielding applications. It is a good fit for a number of applications involving the aerospace, electronic and specialty OEM industries as well as vacuum and cleanroom applications where electrical conductivity and NASA low outgassing are desirable.
Product Advantages
Convenient mixing: one to one mix ratio by weight or volume
Cures at ambient or elevated temperatures
Good electrical and thermal conductivity, especially for grounding, shielding and static dissipation
Very good toughness; can hold up to thermal cycling
High bond strength to similar and dissimilar substrates
