Key Features
- Low viscosity
- Not premixed and frozen
- Good electrical conductivity
- NASA low outgassing
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Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. It is low in viscosity and flows smoothly and easily. It is not premixed and frozen and has an unlimited working life; it will not cure until heated. The cure schedule is simple and straightforward, 60 to 90 minutes at 80°C. It has superb dimensional stability, very low shrinkage upon curing, and contains no solvents or diluents.
EP4S-80 bonds well to a wide variety of substrates such as metals, ceramics, composites, and many plastics. It is a high modulus, high compressive strength system. Its electrical conductivity is satisfactorily functional, with a volume resistivity between 0.02 to 0.06 ohm-cm. EP4S-80 fits very nicely in bonding, sealing and gap filling applications, particularly for static dissipation and EMI/RFI shielding. It can also be considered for specialty encapsulation type applications where electrical conductivity is desirable. This system resists water, oils and fuels. The service temperature range is -60°C to +150°C. EP4S-80 should be considered in a broad array of electronic applications including opto-electronics, acoustical, automotive systems, as well as PCB assembly.
Product Advantages
- One component, no mixing needed
- Will not cure until heated
- Curing temperature 80°C
- Low viscosity
- Brushable
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