Master Bond EP110F8-5 is a two part epoxy resin system with a pot life of 2-3 days at room temperature. This moderate viscosity system has a convenient and forgiving one to two mix ratio by weight and may be used for potting, sealing, encapsulating and casting. It requires an elevated temperature cure at 250-300°F. EP110F8-5 key features are its especially low shrinkage and dimensional stability.
Product Advantages Easy processing, convenient 1 to 2 mix ratio by weight Moderate viscosity, good flow Long working life at room temperature Rigid but tough Superior electrical insulation properties
