Presenters:
John Parry, Mentor Graphics
Justin Kolbe, The Bergquist Company
Originally Broadcast: Monday November 24, 2008
View the archived presentation
Length: Approx. 80 minutes, including questions from Webcast attendees.
OVERVIEW:
Thermal management is a critical aspect of the design of almost every LED module, light engine, lighting fixture and display. Our speakers will discuss the fundamentals of thermal management and describe how simulation can assist with the design process. They will also discuss how the correct choice of thermal materials will help to make your product a success.
SPONSORS:
Mentor GraphicsMentor Graphics® is a technology leader in electronic design automation (EDA), providing software and hardware design solutions that enable companies to develop better electronic products faster and more cost-effectively. The company offers innovative products and solutions that enable engineers overcome design challenges faced in the increasingly complex worlds of board and chip design. Mentor Graphics has the broadest industry portfolio of best-in-class solutions. For more information, please visit www.mentor.com. The Bergquist Company
WEBCAST DETAILS:
LEDs can be the most components in a lighting product, but poor thermal design can lead to low light output, low reliability and even catastrophic failure.
The first part of this Webcast will discuss the need for thermal management of power LED devices, and the need for standardization with respect to the thermal data supplied by vendors. Considerable care is needed when applying JEDEC standard thermal metrics developed for ICs to LED devices. Misunderstandings about what should be measured and reported, and how this data should be applied will be discussed since this can lead to significant errors in thermal design.
Examples of the measurement techniques used by two of the leading LED vendors will be presented to provide an appreciation of both their expertise and the data they provide to customers. A recipe for system designers will be discussed and an example of system level thermal design shown to illustrate the overall approach.
ABOUT THE PRESENTERS:
John Parry:
Dr. John Parry, CEng. is the Research Manager - Mechanical Analysis Division with Mentor Graphics.
John is now responsible for the Mechanical Analysis Division's research activities and education programme. His technical contributions have recently been in electronics cooling, and include the development of compact thermal models for fans, heat sinks, and chip packages, publishing several papers in these areas. He also has expertise in Design of Experiments and optimisation.
As Research Manager John has coordinated 2 EC-funded projects, managed 3 Knowledge Transfer Programmes and several strategic internal projects, including the technical integration of MicReD's business into Flomerics Group PLC.
John serves on several conference committees and was General Chair of SEMI-THERM 21.
Justin Kolbe:
Justin Kolbe is a Senior Research and Development Engineer at The Bergquist Company.
As a Senior R&D Engineer, Justin specializes in the research and development of innovative new materials and processes for the thermal management of power applications. Justin frequently presents at conferences and exhibitions educating attendees on the effectiveness and benefits of insulated metal substrates in the dissipation of heat from LEDs.