| | | | | | | Sponsored | | | | Master Bond EP114 is a low outgassing, nanosilica filled epoxy adhesive with enhanced dimensional stability and exceptionally low shrinkage upon curing. Its Tg exceeds 200°C and the service temperature range is -100°F to +550°F. It has an unusually low viscosity along with a very long open time of 2-4 days. EP114 is best suited for small potting, encapsulation, sealing and coating applications. |
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| | | | Sponsored | | | | A Family of High Power LED Drivers with exceptional performance (Programmable, >90% Efficiency, up to 10 Years Warranty,IP67,10kV Surge Protection). With advanced technology, it ensures precise and efficient power delivery for high-power LED systems. Features include dimming capabilities,wide voltage input range and robust protection mechanisms,making it perfect for various lighting applications. |
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