Indium Corporation has expanded its portfolio of precision preforms with an ultra-thin AuSn preform designed for semiconductor laser applications, where thermal management has become a challenge.
Indium Corporation’s AuLTRA® ThInFORMS™ are 0.00035-thick (0.00889mm- or 8.89μm-) 80Au20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA® ThInFORMS™ help combat common issues, such as:
· Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting
· Poor thermal transfer—the ultra-thin 0.00035” preform reduces bond-line thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device.
For more information about Indium Corporation’s precision gold products, visit www.indium.com/gold.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
