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Thermal substrate materials
Ventec International Group
Chip-on-board (COB) arrays
Future Electronics
Optical materials & components
Materion Advanced Materials
Contract manufacturing for LED assemblies
COFAN
CSP LEDs
DK Ceramic Circuits BVBA
Mounting systems
Hydro - Extrusion North America
Custom modules & prototyping
Aluwave AB
Electronic design & consulting
Electronic Interconnect
Connectors & cables
DP Patterning AB
Wafers & substrates (sapphire, Si, SiC, GaAs, AlN, ZnO)
Cambridge Nanotherm Ltd
Backlight units (BLUs) & components for LCDs
Heraeus Electronics
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Senior Operations LLC Metal Bellows
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SinkPAD LLC
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The Bergquist Co, a Henkel Co
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Plansee SE
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Elite Advanced Technologies
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AI Technology Inc
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Viking Tech America
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American Standard Circuits
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Marian Inc
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Arlon LLC
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Poole Sheet Metal
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US Casting Co
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Metal Coaters
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Jiangsu Tetra New Material Technology Co Ltd
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Stanford Advanced Materials
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Taconic Advanced Dielectric Div
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Interplex Engineered Products
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Shanghai Rare Metal Advanced Materials Co Ltd
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Chooyu Chemical Co Ltd
Insulated metal substrates
Laird Technologies
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DK Thermal Solutions
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Thermastrate Ltd
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DuPont Electronic Technologies
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Fujipoly America Corp
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Fuji Polymer Industries Co., Ltd.
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Shenzhen Retop LED Display Co Ltd
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Insulated metal substrates
Nanotherm LC
Cambridge Nanotherm Ltd
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