Also, Lynk Labs is collaborating with Cool Polymers, a developer of conductive plastic packaging materials, on a new patent-pending packaging technology called ThermaLynk. The material can be formed into carriers or packages with good conductivity, very low weight, fewer thermal interfaces. The next step will be to develop "chip-on-luminaire" products in which chips are mounted directly onto lighting fixtures made from the conductive polymer material. For more details on both these Lynk Labs innovations, see our news item to be published tomorrow (Nov 3).
Optical materials
Silicone manufacturers were very much in evidence, emphasizing the importance of this material for high-power LED packaging. Dow Corning and 3M both spoke in the conference along with Shin-Etsu, who provided delegates with excellent T-shirts. Also represented were NYE Lubricants, GE-Silicones, Quantum Silicones.
For Asymtek, the focus is on dispensing materials such as silicones onto the chip or package. The company says that, with the appropriate materials, its automated dispensing systems are able to reduce costs in high-volume assembly, with tight process control.
LEDs for projection
Osram Opto's booth had a taillight from a VW Golf Plus (see news item), as well as a mini projector from Samsung using Ostar projection LEDs.
Epitaxial wafer supplier Bandwidth Semiconductor has entered into a five-year manufacturing agreement in which it will be the exclusive supplier to Principia Lightworks of Woodland Hills, California. The epitaxial wafers will enable Principia to begin high-volume production of its patented eVCSEL – the electron-beam-pumped vertical-cavity surface-emitting laser (eVCSEL) as a light source for projection display applications, including rear-projection consumer television (RPTV). See link for more details.
Packaging
BBG Micro has developed a power LED package called Trident, made from copper alloys and liquid crystal polymer (LCP). This allows for higher power and cooler junction temperatures in a small package. Different versions of the 7 x 7 mm footprint package accept 1, 3 or 4 LED chips in separate sub-cavities, which have angled walls to maximize light extraction. The package design allows silicone fill from on top or from underneath.